E1: A dongle, with embedded computing capability, placed in a communication path and capable of passing information from a control device through an access point to a semiconductor fabrication machine.

E2: The dongle comprising a network interface configured to receive instructions and an associated identification number from an access point.

E3: The dongle comprising a machine interface configured to interface with the semiconductor fabrication machine.

E4: The dongle further comprises a memory for storing instructions and a processor configured to execute the instructions to perform at least one fabrication operation.